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Crystalaid Manufacture possesses an in-house capability to provide: • Manufacture, assemble, finish and integrate Printed Circuit Assemblies, using SMT, through-hole and chip (die) on board technologies to IPC Class 3 standard, ranging from stand alone PCA production to Turnkey solutions. • Support services include: - First article inspection (AS9102), - Collaborative design for manufacturer - Product and component traceability - Procurement (BOM etc). • Testing (ICT 2D & 3D X-ray, AOI ) including specific PCA functional testing • Certified ISO Class 7 Clean Room processes incorporating Die and Wire Bonding, encapsulation and packaging of die, BGA backfill, Glob topping and Chip-on-Chip technologies • SMT placement accuracy of 30 µm at 6s • Ball, wedge and ribbon wire bonding (process accuracy <10 µm at 6s) • PCA Cleaning to < 0.8 µg NaCl/cm2 exceeding MIL-STD-2000A • Conformal Coating.
DISCRIMINATORS: • 'Build to Print' philosophy and work practices • World Class practices are implemented and verified • Active reduction of carbon footprint and maintenance of environmentally safe processes • All staff responsible for Quality Control at every level • Lean and Agile Manufacture principles are adopted and implemented • 5S principles are implemented • New factory, new machinery, many technologies implemented • Continuous ESD protected zone management • Security of intellectual property, incorporating centralised access control and monitoring • 'Paperless environment'. All access to work areas and secure zones are accessed controlled at individual level and monitored 24 hours • Digital signoff on manufacturing route completion • ‘Goto’ reputation for tough jobs • Prototype (i.e. 1 x PCA) to full Production volumes.
Manufacturer
Independently Certified: AS 9100 Rev B, ISO 9001:2008
Last Updated: May 16, 2012
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